Longsys Drives Smart Storage for AI at MWC 2026 BARCELONA, Spain, March 4, 2026 – Longsys (301308.SZ), a global leader in semiconductor memory, has unveiled its latest integrated storage solutions at Mobile World Congress 2026 under the slogan “AI Storage for the Mobile World.” The company showcased how its innovations are transforming traditional storage into platforms optimized for artificial intelligence, covering everything from smartphones and wearables to PCs and robots. The rapid evolution of AI devices demands storage solutions that combine high capacity, performance, energy efficiency, and deep integration between hardware and software. Longsys, leveraging its expertise in controllers, firmware, packaging, and advanced manufacturing, is solidifying its transition from a standard supplier to a leading brand in integrated memory solutions for AI. During MWC 2026, Longsys demonstrated advancements in mobile AI storage, portable AI, AI in PCs, and robotics. Efficient and Powerful Storage for AI Mobile Devices To address the challenges of DRAM demand, Longsys has developed HLC (High-Level Cache) technology, which incorporates advanced caching in its UFS products. This innovation allows for the management of hot and cold data directly in the UFS, reducing reliance on DRAM and optimizing manufacturing costs in AI smartphones, tablets, and robots without sacrificing user experience. Additionally, the integration of pTLC in the UFS line allows switching between QLC, TLC, and SLC modes via firmware, achieving data retention similar to TLC but at lower costs, balancing capacity, performance, and durability for demanding AI applications. Ultracompact Solutions for Smart Wearables In response to the rise of wearable devices like smart glasses and watches with AI, Longsys has launched the ePOP5x, ePOP4x, and Subsize eMMC solutions. The new ePOP5x, the flagship of the range, maintains the size of the previous generation but reduces its thickness by 35%, reaching just 0.52 mm. It also doubles DRAM speed to 8533 Mbps and offers flexible configurations, ideal for next-generation wearables that require a small size and low power consumption. Advanced Storage for AI PCs For real-time data processing challenges in AI PCs, Longsys highlights its high-bandwidth, low-latency mSSD. Based on this, its Lexar brand has developed the AI Storage Core architecture, enabling flexible, high-capacity storage solutions with hot-swappable capabilities. Among the new products are the AI-Grade Storage Stick for laptops and the AI-Grade SSD, both optimized for high-performance AI tasks. With capabilities ranging from controller design to manufacturing, Longsys is building a comprehensive storage ecosystem for AI, offering competitive solutions tailored to the demands of the new era of artificial intelligence in devices. About Longsys Founded in 1999, Longsys is a global leader in semiconductor memory, integrating R&D, design, packaging, testing, manufacturing, and sales. Its vision “Everything for Memory” drives innovation and the provision of customized, high-end services worldwide. More information at https://www.longsys.com/ and on its social media. Source: europapress.es